Field Application Engineer

ZutaCore is seeking a customer-facing Field Application Engineer to connect customers with its engineering, product, and commercial teams. The role supports technical engagements from solution design and evaluation through integration, validation, deployment, and ongoing technical support, with a focus on mechanical and thermal engineering, servers, data centers, and cooling infrastructure.

Responsibilities:

• Serve as a technical point of contact for customers, OEMs, partners, and system integrators
• Support customer engagements from initial technical discussions and design reviews through integration, validation, and deployment
• Translate customer requirements into technical solutions using ZutaCore's liquid cooling technology
• Support system architecture, thermal and mechanical integration, and product configuration
• Lead and support technical presentations, demonstrations, evaluations, and proof-of-concept activities
• Troubleshoot complex technical issues in lab and customer environments and drive issues to resolution
• Support RFP/RFQ processes and provide technical input to commercial opportunities
• Work closely with Sales, Product, R&D, Customer Success, and Operations throughout the customer lifecycle
• Gather customer feedback and field insights and translate them into actionable input for Product and R&D
• Develop technical documentation, application guidance, and best practices
• Travel to customer and partner sites as required

Requirements:

• Bachelor's degree in Mechanical Engineering, Thermal Engineering, Electrical Engineering, or a related technical discipline
• 5+ years of experience in Field Applications Engineering, Solutions Engineering, Systems Engineering, or a similar customer-facing technical role
• Strong understanding of thermal management, cooling systems, or data-center/server infrastructure
• Hands-on experience supporting complex hardware or integrated systems
• Experience working directly with customers on technical requirements, design reviews, troubleshooting, and deployment
• Strong problem-solving skills and the ability to independently drive technical issues to resolution
• Excellent communication and presentation skills, with the ability to communicate effectively with both engineering and business stakeholders
• Experience with direct-to-chip liquid cooling, cold plates, two-phase cooling, or other advanced thermal-management technologies
• Experience with AI/HPC servers, GPUs/CPUs, server OEMs, or semiconductor technologies
• Knowledge of data-center infrastructure and high-density compute environments
• Experience working with OEM/ODM partners or hyperscale/data-center customers
• Experience supporting product qualification, validation, and new-product introduction