Engineering Project Manager (PIC) Fabrication

Nokia is a networking and technology company developing next-generation photonic integrated circuits for AI data center fabrics and coherent transport networks. The Engineering Project Manager will lead PIC fabrication project execution, coordinate optical design, fabrication, packaging, and product teams, and manage schedules, risks, tools, and project reporting.

Responsibilities:

• Project Execution & Lifecycle Management: Own the execution schedule, milestones, and deliverables for PIC fabrication projects
• Cross-Functional Coordination: Facilitate daily synchronization between optical design engineers, mask layout teams, internal fabrication operations, packaging specialists, and product management
• Tool and Process Alignment: Partner closely with internal fabrication engineering teams and dedicated processing tool owners to optimize hardware queues, schedule critical preventative maintenance, and prevent line bottlenecks during engineering runs
• Risk & Bottleneck Management: Proactively identify critical path dependencies, technical roadblocks, processing tool constraints, and material supply risks
• Project Reporting: Maintain clear project dashboards. Communicate technical status, resource constraints, and key metrics regularly to senior leadership and engineering stakeholders

Requirements:

• Education: Bachelor's, Master's, or Ph.D. Degree in Engineering, Physics, Optics, Materials Science, or a related technical/science discipline
• Experience: Minimum of 5+ years of professional experience in a hardware engineering, product development, or project management role
• Project Management Fundamentals: Proven experience managing project timelines, organizing complex technical deliverables, and utilizing project management software (e.g., Smartsheet, Jira)
• Communication: Exceptional verbal and written communication skills, with a demonstrated ability to translate complex hardware status into structured, actionable project updates
• Basic understanding of semiconductor manufacturing environments, cleanroom protocols, and the operational cadence of dealing with processing tools and wafer-handling coordination
• Analytical Thinking: Skills to analyze requirements for completeness, consistency, and feasibility
• Familiarity with semiconductor design lifecycles, particularly tape-out processes, cleanroom assembly, testing, or packaging
• Direct exposure to InP substrates, fabrication processes, coherent optical subsystems, or fiber-optic communications systems is a significant plus, though strong execution skills remain the primary focus
• An agile mindset with the ability to navigate shifting priorities in a fast-paced, R&D-heavy semiconductor environment