About this role

Serve as a technical expert for advanced packaging technologies, 2.5D/3D
Work directly with key suppliers to develop and enable new processes
Engage with leading assembly suppliers to understand assembly process
Define assembly process integration and flow for advanced multiple die heterogeneous integration
Develop comprehensive plans of assembly and reliability
Resolve design challenges and implement working solutions using DfM/DfR principles

BS/MS/PhD in Mechanical Engineering, Materials Science, Physics or a closely related field
5+ years of progressive experience in Semiconductor Packaging and Assembly Industry
Proven experience in advanced packaging technology development and execution
Comprehensive knowledge and understanding of advanced CoWoS package assembly and manufacturing flow
Previous experience with substrate manufacturing processes and design rules
Experience with package design physical attribute and material selection

ASIC Engineer

Key skills