Drive thermal-mechanical co-design across chiplet, package substrate, cold plate, heatsink, and system-level integration.
Collaborate with package design teams to optimize stack-up, warpage, stiffness, CTE management, and assembly robustness.
Evaluate emerging cooling technologies including direct-to-chip liquid cooling, embedded cooling, vapor chamber integration, and advanced TIM solutions.
Perform detailed thermal and thermo-mechanical simulations using industry-standard tools.
Define integration strategies enabling customer adoption of novel thermal solutions into final package assembly flows.
Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment.

MS or PhD in Mechanical Engineering, Thermal Engineering, Materials Science, or related field
10+ years of experience in semiconductor thermal engineering, advanced packaging, or high-performance computing systems
Experience with thermal and thermo-mechanical simulation tools such as ANSYS, Icepak, COMSOL, Abaqus, or equivalent
Experience developing thermal solutions for high-power semiconductor devices or advanced packaging applications
Strong understanding of reliability physics including warpage, CTE mismatch, TIM performance, and thermal cycling
Knowledge of package assembly processes, substrate manufacturing, and OSAT workflows

Lead Thermal Mechanical Engineer

Key skills