Overall responsibility for the planning and management of internal and external projects related to the development of Electronics Advance Interconnect Solutions with a focus on Wafer Level Packaging Solutions.
Responsibility for assembling project teams, defining schedules, tracking technical activities, and generating project progress reports.
Work on a global level with R&D teams (US, Europe, Asia), internal stakeholders, to ensure the relevant expertise is employed in defining, planning and executing projects.
Carry out cost, time and resource planning for the projects, assess project risks and define countermeasures.
Work closely with Line of Business Project Managers, Product Managers, as well as Manufacturing and Quality to ensure continuous alignment and up-to-date information flow.
Support the design of internal processes and the optimization of project management methods.

B.Sc degree in Material Sciences, Chemistry, Physics, Chemical Engineering or other related technical discipline; MS strongly preferred.
Relevant Project Management training (PMP/CSM/CPMP or similar) strongly preferred.
Experience in management of Technology-Oriented Projects and/or work experience in the field of Electronics.
Capable to manage complex projects and employ different management concepts such as Agile, Waterfall and others as needed.
Bottom-line oriented, assertive and resilient team player able to operate within a high-performance cross-cultural team.
Comprehensive computer skills including Microsoft Office, Excel, Visio, MS Projects and similar.
Willingness to occasionally travel and build strong international relationships, less than 15% for domestic and overseas.

Project Manager

Key skills