Analog Mixed-Signal IC Design Engineer (Data Converters) - TeraWave

Blue Origin is seeking a Principal IC Design Engineer to lead development of high-speed data converters and other analog/mixed-signal circuits for its TeraWave satellite communications network. The role focuses on architecture, modeling, circuit design, integration, verification, silicon validation, and mentoring engineers.

Responsibilities:

• Lead the architecture, development and integration of advanced high-speed data converters (ADCs and DACs), as well as other fundamental analog/mixed-signal functions in advanced FinFET CMOS technologies, focusing on performance optimization, power and trade-off analysis
• Develop high-level behavioral models in MATLAB, Simulink, or SystemVerilog-AMS to validate system performance before circuit implementation
• Utilize full proficiency in Spectre and AMS flows to develop high-performance mixed-signal circuits and systems
• Collaborate with system architects to define block-level performance and interface requirements based on system specifications, ensuring seamless integration into RF payloads and terminals
• Oversee layout, top-level integration, floorplanning, and verification of the overall design for successful tape-out cycle
• Work closely with validation and product engineers to develop test plans, facilitate bring-up, optimize performance, and ensure reliable & high-yield production cycles
• Investigate and implement fundamental analog building blocks to enhance overall circuit performance and mentor junior engineers for best design practices in analog domain

Requirements:

• Bachelor's degree in Electrical Engineering, or related technical discipline
• 10+ years of industry experience, or the combination of industry experience and equivalent research from a PhD program
• Proficiency in the design of high-speed ADCs and/or DACs in FinFET technologies
• Proficiency in the design of SerDes for high-speed data converters such as DACs
• Familiarity with analog-to-digital conversion architectures and techniques such as SAR, pipeline, TDC, delta-sigma, interleaved sampling, RF, and sub-sampling
• Understanding of digital calibration algorithms for impairments of said architectures and techniques
• Proficiency in mixed-mode and analog/RF modeling, simulation, and verification methodologies using toolsets such as MATLAB, Spectre, SystemVerilog, and AMS
• Deep understanding of Electromigration and layout-dependent effects on circuit performance, namely in advanced FinFET technologies
• Extensive experience in silicon characterization and debugging
• Strong background in fundamental analog/RF building blocks, including amplifiers, filters, oscillators, reference generation and LDOs
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum
• MS or PhD in Electrical Engineering or related technical discipline
• Familiarity with RF design concepts and metrics such as noise figure, intercept points, line-up analysis, etc
• Prior experience as a Chip lead for complex front-end IC design and development
• Fundamental understanding of device physics for process selection and performance optimization
• Familiarity with chip-level ESD protection design and verification
• Familiarity with digital design, digital verification, and SystemVerilog modeling