Senior PCB Design Layout Engineer Job Details | Penguin Solutions

Penguin Solutions is an AI factory platform company developing high-performance memory and advanced hardware products. The Senior PCB Design Layout Engineer will execute complex PCB layout and design for high-speed digital, mixed-signal, and power applications, collaborating across engineering, manufacturing, fabrication, assembly, and customer-facing teams from concept through production release.

Responsibilities:

• Own PCB design layout execution from initial floor planning through release to fabrication and assembly
• Work closely with hardware engineers, SI/PI engineers, mechanical engineers, PCB designers, manufacturing, and test teams to design new products and modify or sustain existing products
• Create PCB component footprints per applicable IPC standards and manufacturer data sheets, when needed
• Create and review multilayer PCB stack-ups, including impedance-controlled, high-speed, mixed-signal, power, and HDI designs
• Define board outlines, mechanical constraints, placement keepouts, route keepouts, and other physical design requirements
• Identify signal topologies and implement electrical constraints using Cadence Allegro Constraint Manager
• Perform component placement and PCB routing, including differential pairs, controlled impedance lines, fine-pitch BGA escape routing, and tight length-matching requirements
• Define and implement high-speed PCB design constraints for DDR, PCIe, CXL, and other high-speed interfaces
• Work with SI/PI engineers to support signal integrity, power integrity, stack-up definition, impedance control, routing strategies, return-path planning, and crosstalk mitigation
• Support power delivery network design through power plane planning, decoupling strategy, and PDN-aware placement and routing
• Collaborate with PCB fabricators on stack-up, material selection, impedance targets, HDI construction, DFM, yield, cost, and schedule tradeoffs
• Prepare fabrication drawings, assembly drawings, Gerber files, ODB++/IPC-2581 files as required, and complete PCB release packages
• Lead placement reviews, routing reviews, post-layout reviews, and DFM reviews, and support schematic and manufacturing readiness reviews
• Mentor junior PCB designers and help improve PCB design standards, library practices, constraint methodology, and release processes
• Stay current with industry standards, PCB fabrication technologies, design tools, and best practices, and recommend improvements where appropriate

Requirements:

• 8+ years of PCB design/layout experience for high-speed digital, mixed-signal, and power designs
• 5+ years of hands-on experience with Cadence Allegro and OrCAD Capture
• Strong experience with high-speed digital design practices, controlled impedance routing, differential pair routing, length matching, timing/skew management, topology implementation, return paths, and crosstalk considerations
• Experience with complex multilayer PCBs, preferably 12-24+ layers, including HDI, blind/buried vias, microvias, via-in-pad, sequential lamination, fine-pitch BGAs, and advanced fabrication constraints
• Experience with power supply circuits, analog circuits, mixed-signal layout practices, and power delivery considerations
• Ability to read, interpret, and apply component manufacturer data sheets, reference designs, layout guidelines, and fabrication requirements
• Ability to interface with customers and internal stakeholders to understand requirements and translate them into manufacturable PCB designs
• Self-starter with strong organizational skills, attention to detail, ownership mindset, and excellent verbal and written communication skills
• Ability to identify areas of innovation in memory design
• Bachelor's degree in Electrical Engineering, Electronics, or related technical discipline preferred; equivalent experience will be considered
• Master's degree is a plus
• Working knowledge of JEDEC DDR4 and DDR5 standards is highly preferred
• Experience with DDR3, MRDIMM, CXL, PCIe, or other high-speed memory interfaces is a plus
• Experience designing memory modules, server boards, accelerator cards, storage products, or high-speed embedded systems is a plus
• Experience with invention disclosure or patent processes is a plus