Senior Connector Development Engineer

Amphenol Communications Solutions (ACS) is a global provider of high-performance interconnect solutions for communications, data center, networking, and other technology markets. The Senior Connector Development Engineer will lead the design, development, evaluation, and qualification of advanced connector and cable solutions while collaborating with customers, global teams, manufacturing, sales, and marketing.

Responsibilities:

• Lead the planning, design, and execution of connector and interconnect development projects from concept through evaluation and qualification
• Design high-speed connectors, power connectors, and cable assemblies, including card edge, memory, and storage connectors
• Collaborate with global customers and cross-functional teams to define requirements and deliver innovative interconnect solutions
• Apply knowledge of server/storage architectures, industry standards (PCI-SIG, OCP, JEDEC, SFF), and signal integrity principles
• Develop prototypes, oversee testing/qualification, and ensure compliance with industry and customer performance standards
• Conduct cost analysis, provide design trade-offs, and support decisions for product management and manufacturing
• Benchmark competitive products to drive differentiation in performance, cost, and manufacturability
• Provide technical support to Sales and Marketing, including customer training, presentations, and direct engagement
• Partner with Manufacturing to address cost reduction, quality improvement, and customer issue resolution
• Stay current with technology trends and emerging interconnect solutionsincluding power interconnect innovationsto guide future product development

Requirements:

• Bachelor's degree in mechanical engineering, Electrical Engineering, or a related technical field
• 8+ years of experience in connector and/or cable assembly design and development
• Proven experience with card edge, memory, power connectors, and high-speed cable assemblies
• Familiarity with industry standards such as PCIe, DDR, OCP, JEDEC, and SFF
• Strong analytical, problem-solving, and design skills
• Excellent communication and interpersonal skills with the ability to collaborate across global teams
• Proficiency in 3D modeling tools (e.g., Creo) and Product Data Management systems (e.g., Windchill) preferred