Senior Package Layout Engineer - Hardware

NVIDIA is a world leader in GPUs and SOCs, continuously innovating to deliver creative solutions across various sectors. They are seeking a Senior Package Layout Engineer to collaborate with design teams on the layout of IC substrates, addressing manufacturing and design issues while optimizing package performance.

Responsibilities:

• As part of a Layout team, you will collaborate to implement high speed/density ASIC packages
• Perform substrate breakout patterns for ASIC packages
• Optimize package pinout incorporating system level trade-offs of pins assignment
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

Requirements:

• Hold a B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
• Solid understanding of high-speed design signal integrity practices
• Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages, preferred
• Experience with Virtuoso and Calibre is a plus
• Experience using Valor is helpful