Technical Program Manager (TPM) – Advanced SoC Physical Design

HCLTech is looking for a highly talented and self-motivated Technical Program Manager (TPM) – Advanced SoC Physical Design to join it in advancing the technological world through innovation and creativity. The role involves leading complex SoC implementation programs and requires strong technical expertise in Physical Design along with program leadership skills.

Responsibilities:

• Leading end-to-end execution of complex SoC implementation programs from RTL handoff through GDSII signoff
• Combining deep technical expertise in advanced-node Physical Design with strong program leadership, customer engagement, risk management, and cross-functional coordination across Design, Verification, DFT, Package, CAD, and Silicon Validation teams
• Serving as the single point of accountability for delivery predictability, schedule adherence, quality, customer communication, and successful tape-out execution

Requirements:

• 10+ years of semiconductor industry experience
• Strong hands-on expertise in SoC Backend/Physical Design including
• Strong understanding of RTL-to-GDSII flows and post-silicon activities
• Experience working with Synopsys/Cadence tools such as ICC2, Fusion Compiler, Innovus, PrimeTime, Tempus, RedHawk, and Calibre
• Proven ability to manage cross-functional teams and drive customer-facing engagements
• Experience leading full-chip SoC implementation programs at advanced technology nodes (7nm/5nm/3nm preferred)