Analyze, improve, and define subsystem architectures that directly influence system performance, throughput, and reliability
Lead the design and integration of complex subsystems used in advanced semiconductor capital equipment
Architect mechanical, thermal, fluid, and structural solutions that drive system performance and reliability
Analyze and define system and subsystem interfaces, requirements, and specifications
Perform structural, thermal, dynamic, and vacuum-related analyses using advanced FEA tools
Lead cross‑functional design reviews and drive subsystem integration, optimization, and design validation
Support NPI, RFQ processes, qualification testing, and component lifecycle management
Ensure design compliance with global regulatory standards
Develop and maintain robust documentation including BOMs, specifications, test plans, qual plans, and ECOs.

Bachelor’s degree in mechanical, systems, or related engineering field
5+ years experience in semiconductor capital equipment or wafer‑fab, advanced packaging environments
Expertise in mechanical design, precision systems engineering, mechatronics, power systems, and fluid/vacuum systems
Proficiency in FEA, CAD, and structural/thermal analysis tools
Strong communication, documentation, and cross‑functional collaboration skills
Demonstrated ability to lead reviews, guide teams, and interface with customers
Ability to travel domestically and internationally up to 30%.

medical, dental, and vision insurance plans
paid time off accruing at a rate of 3.07 hours during your first year of employment
4 weeks of paid parental leave
11 company-paid holidays (9 fixed holidays and 2 optional floating holidays)
401(k) retirement plan
employee stock purchase plan

Principal Systems/Mechanical Design Engineer, Semiconductor

Key skills