Meta Platforms, Inc. is seeking a senior PCB Layout Engineer to join their cutting-edge AR hardware team focused on next-generation wearable products. The role involves leading complex PCB layout projects and collaborating with various engineering teams to resolve design challenges and improve production efficiency.
Responsibilities:
- Lead and manage multiple complex PCB layout projects (rigid, rigid-flex, and flex) for both product and prototype/test applications
- Drive project meetings including kick-off, placement, constraint, and design reviews
- Apply deep knowledge of power distribution, high-speed circuits, and RF signal design
- Collaborate cross-functionally with EE, ME, TPM, DFM, and SiPi teams to resolve design challenges
- Engage with external suppliers and SQE/PE to address DFM issues and ensure high-yield builds
- Identify and propose solutions to improve production efficiency and resolve execution risks
- Develop and test prototypes; assess for issues, risks, and failure points
Requirements:
- 8–10+ years of complex PCB design experience
- 5+ years with Cadence Allegro (v21 or newer)
- Rigid-flex and flexible circuit design experience
- HDI (high-density interconnect) PCB design experience
- Strong communication and cross-functional collaboration skills
- Experience with miniaturization in dense form-factor designs (wearables, mobile)
- Manufacturing/DFM process exposure
- Continuous improvement or production efficiency mindset
- BS in Electrical Engineering