Conduct thermal simulations and analysis using Flotherm, focusing on rack/sub-rack level designs.
Choose and design heat sinks, fans, heat pipes, and TIMs to meet thermal requirements.
Optimize the number of simulations and provide clear recommendations in reports.
Independently perform thermal testing for line cards, racks, sub-racks, and power supplies.
Conduct airflow impedance testing and acoustics testing for telecom applications.
Operate thermal chambers and use thermocouples/airflow sensors for accurate measurements.
Understand and apply environmental standards like NEBS/ETSI/GR-3108 for thermal design.
Collaborate with the team to ensure the mechanical design of heat sinks meets limitations and manufacturing constraints.

Bachelor's or Master's degree in Electronics/Electrical Engineering or a related field.
2-5 years of experience in electronics cooling background, with a focus on PCBA thermal design.
Proficiency in Flotherm for thermal simulations and a strong understanding of thermal testing standards.
Experience in choosing and designing heat sinks, fans, and other thermal management components.
Knowledge of multiple TIMs and their applications, along with an understanding of fan design parameters.
Working knowledge of Creo for mechanical design is preferred.
Independent thermal testing experience for telecom equipment is an advantage.
Ability to take a methodical approach and provide clear, data-driven recommendations.
Excellent communication and collaboration skills for effective teamwork.
A passion for innovation and a commitment to delivering high-quality hardware solutions.

Digital HW Engineer

Key skills