About this role
Role Overview
- Develop and lead system thermal technology roadmap in partnership with microelectronics packaging suppliers, thermal interface material suppliers, cooling solution providers and internal partners to meet Cisco products’ needs.
- Develop quality strategy for liquid cooling manufacturing process.
- Investigate innovative liquid cooling solutions for hardware systems in large scale.
- Derive the tradeoffs in thermal performance of different package design elements (substrate, underfill, thermal interface material, heat spreader etc.) and chip thermal gradients from experimental test data.
- Develop test plans and qualification requirements to ensure mechanical and manufacturing adaptability of thermal cooling solutions (pumps, heat pipes, vapor chambers, heat sinks, liquid cooling etc.).
- Engage with external vendors including ODM and component vendors on design, test and production.
- Develop and publish case studies/technical papers describing thermal analysis of cooling systems.
- Establish the parameters for thermal design/testing, correlation of design/test results to model predictions.
- Contribute to analytical and numerical models using various Computational Fluid Dynamics tools to simulate and analyze different device level cooling schemes.
- Drive supplier ecosystem development, and participate in industry consortia, conferences and collaborate with academia and other strategic partners to develop new methodologies and influence Cisco’s position in the industry.
- Integrate Circuit Thermal simulation and testing and system level cooling technologies.
- Mechanical design validation and testing for electronic assemblies
- Coordinate Circuit Packaging technologies (BGA, large body size Flip Chip BGA, 2.5D and 3D Packaging)
- Component and system reliability analysis
Requirements
- BS in Mechanical/Thermal or Chemical Engineering
- 10+ years’ experience in design, simulation, and testing of thermal solutions for electronic devices and systems
- Familiar with manufacturing process for key liquid cooling components
- Experience with advanced air-cooling technologies (vapor chamber and remote heat sinks, thermal interface materials, fans/fan trays)
- Preferred: MS or PhD in Mechanical or Chemical Engineering or related field
- 15+ years of relevant proven experience in microelectronics thermal cooling
- Experience with JEDEC JESD 51 thermal testing standards
- Experience with Thermal Interface Material Thermal Conductivity Testing procedures and microelectronics packaging design and manufacturing process
Benefits
- Health insurance
- 10 days off each year for community service
- Professional development opportunities
- Flexible work arrangements