Drive the entire substrate design process, from design through tapeout, with a focus on performance, manufacturability, and cost optimization.
Implement the physical layout and routing of package designs using design tools and methodologies and meeting the design requirements.
Conduct substrate fit and routing studies to evaluate design, performance, and cost tradeoffs.
Documenting the detailed design requirements clearly in the Package Design Requirement Document.
Collaborate closely with silicon and hardware teams to optimize silicon-package-board performance and pinout.
Understand and apply substrate design rules to ensure design quality and compliance.
Conduct internal and external design reviews and resolve design rule checks (DRCs) to achieve optimal package design.
Continuously improve in the package design work either by coming up with innovations or driving efficiencies that helps improve cost, schedule and/or quality for the design that ultimately add value to our company.

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Electronics, or a related field.
At least 4 years of experience in substrate/package design with a Bachelor's degree, 3 years with a Master's degree, or no experience required with a PhD.
Proficiency in substrate layout and routing tools such as Cadence APD or Mentor Xpedition.
Experienced in using Electrical Design Analysis software tool.
Strong understanding of substrate design rules, DRC resolution, and package-board interface optimization.
Experience with data analysis and design documentation tools.
Familiarity with substrate manufacturing and assembly process.

Silicon Packaging Design Engineer

Key skills