About this role

Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)
Review and approve process or material changes introduced by subcontractors (first-level technical gatekeeper)
Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
Monitor and manage subcontractor performance, including operational and quality KPIs
Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
Lead or support cost reduction and value engineering initiatives
Participate in audits (customer, quality, VDA) and support compliance verification activities
Support project milestones, technical reviews, and subcontractor performance reporting

Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field
10+ years of experience in semiconductor assembly / wafer level / backend manufacturing
Strong experience in high-volume and high-mix production environments
Good understanding of semiconductor packaging processes and manufacturing flows
Project management experience in engineering or manufacturing environments
Strong analytical and problem-solving skills

Principal Manufacturing Engineer – Subcon, Backend, Assembly

Key skills