Design and develop high layer count PCB layouts for high-speed digital, radio frequency (RF), and high-power circuit assemblies
Apply contemporary printed circuit board (PCB) design methodologies to ensure superior signal integrity, efficient thermal management, and effective electromagnetic interference (EMI) mitigation
Partner closely with hardware engineers, signal integrity experts, and mechanical designers to lead the optimization of PCB layouts, ensuring adherence to best practices for performance, reliability, and efficient manufacturing processes
Oversee the precise management of all PCB design data, utilizing Product Lifecycle Management (PLM) software to control documentation, revisions, and formal release procedures while guaranteeing full compliance with company quality standards and industry regulations
Implement engineering changes to existing designs (ECO process), update documentation, and manage releases effectively
Design expertise in Cadence Allegro, leveraging the platform for complex design tasks
Requirements
Associate degree, Bachelor of Science in Engineering/Technology, or equivalent practical experience
5+ years of professional experience in PCB Layout
Familiarity with PCB fabrication processes and Design for Manufacturing (DFM) best practices
Proficiency in IPC standards (CID and/or CID+ certifications are a plus)
Proficiency in High-Speed Digital Protocols, including DDR4/DDR5 and PCIe (4/5) implementation
Experience with Flex and Rigid-Flex design methodologies and best practices
Strong ability to read and interpret schematics
Solid understanding of basic electronics principles, theory, and signal integrity issues (reflections, crosstalk, coupling, etc.)
High degree of self-initiative and ability to think and act independently.
A positive attitude and eagerness to learn
Ability to work effectively both independently and as part of a collaborative team