Lead SI analysis for high‑speed serial links and RF interconnects up to ~70 GHz
Use HFSS to model interconnects, packages, transitions, and antenna‑adjacent structures
Use ADS for linear/nonlinear circuit modeling, S‑parameter work, and trade studies
Build, adapt, and correlate IBIS‑AMI models with measurements and full‑wave simulations
Define stackups, materials, impedance targets, and routing rules for SI‑robust designs
Design SOLT/TRL structures, coupons, and procedures for VNA/TDR workflows
Measure and correlate S‑parameters, loss, isolation, and channel performance across simulation and hardware
Diagnose and resolve SI issues including reflections, resonances, crosstalk, and mode conversion
Produce clear reports, guidelines, and review material for cross‑functional teams

Bachelor’s degree in Electrical/Electronics Engineering or related field
5+ years in SI, high‑speed digital, or RF/microwave design
Proficiency with HFSS, ADS, and IBIS‑AMI workflows
Experience defining PCB stackups for high‑speed/microwave designs
Hands‑on VNA/TDR measurement experience
Strong understanding of transmission lines, S‑parameters, loss mechanisms, jitter, crosstalk, and channel budgeting
Ability to work across RF, digital, packaging, and systems teams.

Medical, dental, vision, basic and supplemental life insurance
Paid parental leave
Short and long-term disability
401(k) with a company match of up to 5%
Education Support Program
Stock Options for all regular employees (working at least 20 hours/week)
Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours
Up to 14 company-paid holidays
Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion.

Senior Signal Integrity Engineer – High-Speed Digital, RF

Key skills