Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
Develop, qualify, and support clean launch of new laminate material sets and suppliers in line with centralized Qorvo processes and documentation standards.
Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
Travel to laminate suppliers to provide technical support for technology development, supplier qualification and problem resolution.

10+ years’ direct experience in PCB/mSAP laminate manufacturing
Bachelors or higher degree in Chemistry or Engineering disciplines
Strong communication skills
Industry knowledge and experience with laminate/PCB manufacturing including processes such as mSAP Cu pattern plating, panel plating, surface finishes, etc.
Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc. is a plus.
Recognized understanding of IPC laminate/PCB standards
Strong background in laminate/PCB design rules, manufacturing and qualification standards.
Effective project management skills
Proven record of accomplishment in supporting New Product / Processes and/or Technology through innovative packaging solutions
Fluent in Korean and English.

Principal Engineer – Laminate Substrate Development

Key skills