Providing technical leadership within our global reliability engineering team
Own and lead the new product reliability and qualification plan and risk assessment from the initial concept phase through mass production
Support our cross-functional product teams to ensure that products are effectively stress tested through our qualification process
Collaborate with our wafer fab technology team to understand and evaluate silicon reliability with particular focus on our company specific IP
Work with our assembly and packaging team to evaluate new packaging techniques and component and board level reliability stress testing
Work with internal and external technical groups to develop new capability and reliability methodologies
Support the customer quality engineering team to engage customers and ensure that the reliability and quality of the product meets both internal and external standards
Drive corrective and preventive actions in collaboration with design, process, and manufacturing teams.

BEng / BS in Engineering or Physics and demonstrated hands-on experience in product reliability engineering.
Experience defining and executing IC reliability qualification plans in accordance with JEDEC and other industry standards e.g. Automotive, Industrial.
Working knowledge of Intrinsic and Extrinsic Reliability requirements
Ability to specify stress conditions (e.g. HTOL, HAST, TC, UHAST, ESD, Latch-Up), sample sizes, interim read points, and pass/fail criteria for New Product qualifications and requalification activities in accordance with the manufacturing strategy.
Understanding of semiconductor device physics, IC manufacturing, and packaging technologies.
Excellent interpersonal and customer communication skills.
Understanding of quality system requirements.
Demonstrated analytical skills and the ability to use data-driven approaches to resolve quality and reliability issues.

Reliability Engineer

Key skills